MediaTek · 6 hours ago
Advanced Packaging Architect
San Jose, CA
Full-time
Hybrid
Senior Level
$180K/yr - $256K/yrMediaTek is seeking a talented and experienced technical leader with expertise in Packaging Architect. This role involves close collaboration with cross-functional teams to develop advanced packaging architecture and guide the development of innovative packaging solutions.
Internet of ThingsSemiconductorWireless
Responsibilities
Identify the optimal package architecture by balancing electrical, thermal, and mechanical performance, meeting project’s timeline
Working closely with internal and external partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration
Perform a trade-off analysis across silicon layout, die-to-die connectivity options, and package design/technology, evaluating their impact on key product metrics, including performance, cost, manufacturability, power efficiency, and form factor
Identifying critical elements for packaging roadmap, Partner with supply chain engineering experts to define packaging technology and material requirements for substrate fabrication, assembly, and raw material vendors
Stay informed about emerging packaging architectures by engaging with the product team and customers in the data center and high-end compute segments
Continuously monitor the competitive landscape in packaging technologies and solutions
Qualification
Required
Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS-S/R/L, EMIB/EMIB-T, SoIC, CoW, WoW, POP, etc
Extensive experience in characterization and design of 2D, 2.5D, & 3D flip-chip & wafer-scale packaging solutions; experience in the areas of power-signal integrity, thermal-mechanical & system engineering domains
Proven track record of bringing up successful packages/ products with high power and high bandwidth applications from inception to product introduction
Extensive experience with high-speed interfaces, including SERDES, PCIe, die-to-die (D2D) interconnects and CPO & CPC, with a strong understanding of their impact on packaging technology choices, such as substrate selection, interconnect architecture, signal integrity, CPO & CPC integration, and thermal considerations
Experience in HBM on package integration, DDR integration, and working knowledge of various memory types
Experience in various EDA & CAD tools
Excellent communication skills
About 10-15% international travel required
Benefits
Comprehensive health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO)
Parental leave
401K
Company
MediaTek
MediaTek Inc. is a Taiwanese fabless semiconductor company that provides system-on-chip solutions for wireless communications.
Founded in 1997
10001+ employees
H1B Sponsorship
MediaTek has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (71)
2024 (50)
2023 (62)
2022 (48)
2021 (18)
2020 (28)
Funding
Current Stage
Public CompanyTotal Funding
unknown2001-07-23IPO
Leadership Team
Jack Hu
Developer Relations Manager - MediaTek Labs
Recent News
2026-02-08
2026-02-07
2026-02-06
Company data provided by crunchbase