Amazon · 2 days ago
Hardware Development Engineer, Thin Films, Fabrication, AWS CQC
Amazon Development Center U.S., Inc. is seeking a superconducting thin film engineer for their Center for Quantum Computing (CQC). The role focuses on thin films deposition to support fabrication and studies of superconducting circuits, requiring hands-on production support and process control.
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Responsibilities
Own thermal evaporation processes used for superconducting metals
Deep dive into the hardware, process and physics related to Josephson Junctions or metal-insulator-metal fabrication
Hands-on production support of deposition processes used to fabricate superconducting circuit elements such as indium bumps, airbridges, resonators etc
Lead process control of deposition processes
Devise experiments and provide recommendations for improvement of fabrication processes
Communicate findings with colleagues by way of crisp documentation and presentations
Qualification
Required
4+ years of working in mechanical engineering or equivalent experience
Experience with prototyping and implementation
Preferred
Knowledge of SolidWorks simulation or Ansys Finite Element analysis tools
Experience in the design of complex mechanical products and equipment at volume
Benefits
Health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
401(k) matching
Paid time off
Parental leave
Company
Amazon
Amazon is a tech firm with a focus on e-commerce, cloud computing, digital streaming, and artificial intelligence.
H1B Sponsorship
Amazon has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (22803)
2024 (21175)
2023 (19057)
2022 (24088)
2021 (12233)
2020 (14881)
Funding
Current Stage
Public CompanyTotal Funding
$8.11BKey Investors
AmazonKleiner Perkins
2023-01-03Post Ipo Debt· $8B
2001-07-24Post Ipo Equity· $100M
1997-05-15IPO
Recent News
2026-02-12
2026-02-12
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