Georgia Institute of Technology · 19 hours ago
Research Engineer II- Semiconductor Fabrication and Advanced Packaging
Atlanta Metro
Full-time
Onsite
Mid Level
3+ years expGeorgia Tech is a top-ranked public research university located in Atlanta, GA, committed to innovation and excellence in education. The Research Engineer II will support semiconductor fabrication and advanced packaging activities, focusing on process development and tool ownership in a multi-user research environment. This role involves collaborating on research initiatives and developing solutions for next-generation electronic and sensor platforms.
EducationHigher EducationUniversities
Responsibilities
Support heterogeneous integration research through materials selection, interconnect process development, and multi-layer device integration
Develop and optimize process flows for TSV/TGV fabrication, copper electroplating and RDL formation, wafer thinning (grinding), planarization and CMP, advanced packaging integration, and MEMS/sensor fabrication
Design and execute experimental studies, analyze process data, and establish stable, documented baselines to ensure reproducibility and reliability
Serve as technical owner for fabrication and packaging tools (e.g., DRIE/ICP systems, electroplating systems, grinding and CMP tools, and thin-film deposition systems)
Train and support academic and industry users on cleanroom processes and equipment
Troubleshoot process and equipment issues and coordinate maintenance and continuous improvement efforts
Collaborate with faculty, students, and industry partners on prototype development, sponsored research activities, and technical deliverables
Qualification
Required
A master's degree in science, engineering or related area, and three (3) years of relevant full-time experience after completion of that degree, or
A master's degree in science, engineering or related area, and five (5) years of relevant full-time experience after completion of a bachelor's degree, or
Doctoral degree
Preferred
Master's degree or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field
Experience in semiconductor fabrication and advanced packaging process development
Hands-on expertise in several of the following areas: DRIE/ICP etching, thin-film deposition (ALD/PVD/CVD), electroplating, TSV/TGV processing, wafer thinning, planarization, CMP, or packaging assembly
Experience with high-aspect-ratio via processing and copper fill optimization
Background in heterogeneous integration or wafer-level packaging
Experience in MEMS or sensor fabrication
Prior experience in an academic cleanroom or semiconductor R&D environment
Demonstrated ability to support research projects and contribute to technical documentation, reports, or publications
Company
Georgia Institute of Technology
Georgia Institute of Technology operates as a state-funded research university.
5001-10000 employees
H1B Sponsorship
Georgia Institute of Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (163)
2024 (189)
2023 (130)
2022 (101)
2021 (40)
2020 (51)
Funding
Current Stage
Late StageTotal Funding
$21.95MKey Investors
US Department of EnergyARPA-ENational Nuclear Security Administration
2024-07-31Grant· $1.97M
2023-11-22Grant
2023-04-26Grant· $11.63M
Leadership Team
Raghupathy Sivakumar
Vice President of Commercialization & Chief Commercial Officer
Ashok Goel
Professor
Recent News
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