Analog Devices · 9 hours ago
Senior Engineer, Semi Packaging Engineering
US, CA, San Jose, Rio Robles
Full-time
Onsite
Mid, Senior Level
$110K/yr - $151K/yr
1+ years expAnalog Devices, Inc. is a global semiconductor leader that bridges the physical and digital worlds. They are seeking a Senior Engineer in Semi Packaging Engineering to develop new product packages, communicate with design teams, and collaborate with cross-functional teams to ensure timely project delivery.
SemiconductorElectronicsDSPLighting
No H1B
U.S. Citizen Only
Responsibilities
New Product Introduction (NPI): New product package development from design through qualification up to release of the product to production. Development of new module package technologies working closely with the product design engineers and the factories
Business Unit (BU) communications: Communicate with design teams to understand the package requirements and to influence package-related design decisions for new product development
Assembly subcontractor/OSATs communications: work closely with ADI’s overseas assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls and oversea travels are expected
Cross functional team collaborations: work closely with reliability team, business units, and supply chain management team to provide package-related engineering support
Project management: plan and drive for on time delivery of development projects
Package bill of material (BOM) selection: solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites
Package Design Rules: Develop and implement package design rules and other specifications for module assembly processes
Package model and drawing creation: Create package design models and drawings for package development, simulation, and documentation
Package process development: Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during NPI. Perform process failure mode and effects analysis (FMEA), execute design of experiments (DOE), implement process change notification (PCN)
Finite element analysis: experience in finite element analysis (thermal, stress, and electrical) is plus
Qualification
Required
Master's degree in Mechanical Engineering, Materials Science and Engineering, Chemical Engineering, Applied Physics, or Electrical Engineering is required with 1-5 years of industrial working experience in related fields
Knowledge in various packaging technologies, process flow, material, qualification, and manufacturing implementation
Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc
Benefits
Medical, vision and dental coverage
401k
Paid vacation
Holidays
Sick time
Other benefits
Company
Analog Devices
Analog Devices (NYSE: ADI) defines innovation and excellence in signal processing. ADI's analog, mixed-signal, and digital signal
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$4.6MKey Investors
U.S. Department of Defense
2025-04-11Post Ipo Debt
2024-09-18Grant· $4.6M
2012-04-02IPO
Leadership Team
Vincent Roche
Chief Executive Officer
John Hassett
SVP Industrial & Consumer Group
Recent News
2026-02-06
2026-01-24
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