Texas Instruments · 8 hours ago
Packaging Engineer - Inductor and Power Module
Santa Clara, CA
Full-time
Onsite
Senior Level, Lead/Staff
$155K/yr - $245K/yr
10+ years expTexas Instruments is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips. They are seeking a Magnetics and Passives Integration Technologist to lead the development of low-profile inductors and integrated passives, ensuring manufacturability and reliability through collaboration with suppliers.
SemiconductorElectronicsComputerDSP
Responsibilities
Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs
Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets
Qualification
Required
MS in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging
10+ years of hands-on experience in power inductor design supporting advanced power topologies, including TLVR & multiphase coupled inductors (upto 20MHz) with a track record of joint development, qualification, and scaling
Strong fundamentals in the physics of magnetic materials: ex. Stoner-Wohlfarth, Steinmetz models, Ollendorf models for composite materials, etc
Experience with Material Characterization (ex; BH analyzer, VSM, SEM, EDX)
Experience in advanced co-packaged power modules
Strong IP generation background in magnetics, packaging, or passive integration domains
Preferred
PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging
System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints
In depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials)
Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing. Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML)
Understanding of material processing: ceramic, metal powder and composite materials
Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc
Deep insights in magnetic supplier capabilities, roadmaps and emerging research
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
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2026-02-07
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