Broadcom · 19 hours ago
hardware engineer 3
Broadcom is seeking a highly skilled and motivated Senior Reliability Engineer 3 to join their team, focusing on RF characterization and reliability test development for their Tuner Switch products. The ideal candidate will serve as a reliability expert and partner to R&D, Design, and Quality teams, ensuring the long-term performance and robustness of products through various testing methodologies.
Telecom & CommunicationsSemiconductorAppsMobileWireless
Responsibilities
The Senior Reliability Engineer will be responsible for defining, executing, and analyzing a combination of electrical, thermal, and mechanical stress tests to ensure the long-term performance and reliability of 'Tuner switch' and related devices fabricated in RF CMOS technology
Developing and executing test plans to assess the switch device's performance across various operating frequencies, power levels, and environmental conditions
Evaluating performance stability over extended stress periods
Establishing and implementing procedures for performing critical RF reliability and performance tests early in the manufacturing process at the wafer level
Designing and conducting ESD robustness tests (e.g., HBM, MM, CDM) to characterize the device's immunity to electrical stress events, a critical failure mechanism
Assessing and validating the device's ability to reliably manage and sustain the high-power levels encountered in typical mobile tuner applications
Utilizing advanced instruments like QFI (Quantum Focus Instruments) or similar IR thermal imaging equipment to monitor heat distribution and hot thermal spots, ensuring the device operates within safe thermal limits under various stress conditions
Developing and executing tests to assess the long-term reliability of the underlying semiconductor IC process and package technologies used to construct the tuner switch
Familiarity and direct experience with advanced life testing methodologies such as RF High-Temperature Operating Life (RF HTOL) and DC HTOL
Leading troubleshooting efforts, conducting root cause analysis, and coordinating failure analysis activities with internal and external labs to drive continuous improvement in design and manufacturing processes
Qualification
Required
Degree in Electrical Engineering, Materials Science, or a related field. Bachelors and 5+ years of related experience or Master's degree and 3+ years of related experience or PhD and no experience and valid visa to work in the US
Minimum of 5 years of experience in semiconductor device reliability engineering, with a focus on RF or power conversion components
Proven experience in designing and executing reliability stress tests, including ESD, HTOL, and thermal testing
Strong analytical skills with the ability to interpret complex electrical and physical failure data
Preferred
Direct experience with RF test equipment and measurement techniques (e.g., VNAs, power meters, spectrum analyzers)
Expertise in RF/microwave semiconductor devices, preferably those used in wireless handsets (e.g., switches, filters, front-end modules)
Familiarity with industry-standard reliability specifications and qualifications (e.g., JEDEC)
Proficiency in statistical analysis tools (e.g., JMP, Minitab) for reliability data
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave and vacation time
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
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