Tenstorrent · 7 hours ago
Chiplet Physical Design Engineer
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. As a Senior Chiplet Physical Design Engineer, you will work on designing and integrating multiple chiplets into a System-in-Package (SiP), collaborating with experts to deliver world-class CPU and AI silicon.
Artificial Intelligence (AI)SemiconductorElectronicsAI InfrastructureApplication Specific Integrated Circuit (ASIC)Machine Learning
Responsibilities
Own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes
Qualification
Required
Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or Computer Science
10+ years of industry experience in physical design for CPU, or GPU products
Strong hands-on experience with Synopsys and/or Cadence tools across synthesis, P&R, and closure
Proven expertise in timing closure, ECO flows, and PV convergence at block and chip level
Proficiency in scripting (TCL required; Python or similar strongly preferred) and strong English communication skills
Benefits
Highly competitive compensation package
Equal opportunity employer
Company
Tenstorrent
Tenstorrent develops AI hardware and software solutions for data processing and machine learning application.
Funding
Current Stage
Late StageTotal Funding
$1.03BKey Investors
AFW Partners,Samsung SecuritiesHyundai Motor Group,Samsung Catalyst FundFidelity
2024-12-02Series D· $693M
2023-08-02Series Unknown· $100M
2021-05-20Series C· $200M
Recent News
2026-01-07
TechRadar.com
2026-01-07
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