Intel Corporation · 11 hours ago
Packaging Customer Engineer
Phoenix, AZ
Full-time
Onsite
Senior Level, Lead/Staff
$191K/yr - $269K/yr
9+ years expIntel Corporation is a leader in the semiconductor industry, focused on delivering cutting-edge silicon process and packaging technology. The Packaging Customer Engineer will collaborate with various teams to drive product architecture, serve as the engineering interface for customers, and manage technology reviews and assessments.
Semiconductors
Responsibilities
Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution
Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer
Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production
Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments
Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap
Represent the customer in internal technology working groups for new technologies during pathfinding and development
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM field
9+ years of experience in semiconductor packaging
Hands-on experience in one or more of the following areas: Power delivery, High‑speed signaling, Thermal‑mechanical analysis, Process development, Die disaggregation architectures
Experience presenting technical information to external customers and suppliers
Preferred
Master's or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM discipline
Strong knowledge of Intel packaging technologies
Benefits
Health
Retirement
Vacation
Competitive pay
Stock bonuses
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
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2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
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