Amkor Technology, Inc. · 19 hours ago
Engineer, Design
Tempe, AZ
Full-time
Hybrid
New Grad, Entry LevelAmkor Technology, Inc. is the world’s largest U.S. headquartered OSAT and a global leader in outsourced semiconductor packaging and test services. They are currently hiring an IC package Design Engineer to create high-quality IC package designs and detailed engineering drawings while sustaining multiple design-related activities within the Design Center.
Telecom & CommunicationsSemiconductorElectronicsWireless
No H1B
U.S. Citizen Only
Responsibilities
Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
Create detailed engineering drawings with little supervision
Utilize skills and experience to solve design problems and customer issues
Seek out opportunities to improve and advance design technology
Exercise responsibility when making design-related decisions
Create and sustain effective, productive, and quality partnerships between the design team and customers
Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required
Create documentation and perform record-keeping
Lead by example while learning
Other duties as assigned
Qualification
Required
This position requires a bachelor's degree in electrical engineering, mechanical engineering, or other relevant engineering disciplines
Demonstrates experience using CAD or equivalent software to create engineering drawings
Excellent verbal and written communication skills required
Demonstrates the ability to efficiently complete tasks with minimal supervision
Must be self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment
Preferred
Semiconductor packaging experience is a plus
Experience using package design and simulation tools (Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350)
PCB design experience is a plus
Working knowledge of GD&T practices is helpful
SI/PI experience is a plus
Company
Amkor Technology, Inc.
Amkor Technology, Inc.
Founded in 1968
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$1.24B2025-09-08Post Ipo Debt· $500M
2025-07-28Post Ipo Debt· $500M
2023-09-06Post Ipo Secondary· $240M
Leadership Team
AMADO ROBLES
DIRECTOR - fcCSP, fcSiP, Hybrid CSP
Recent News
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2026-02-10
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