Microchip Technology Inc. · 7 hours ago
Technician IV - Packaging
Microchip Technology Inc. is a global organization that designs technology powering the world. They are seeking a Technician IV - Packaging to produce IC package outline drawings, manage database for IC assembly Bill of Materials, and collaborate with multiple business units.
Telecom & CommunicationsSemiconductorManufacturingAutomotiveWireless
Responsibilities
Production of IC package outline drawings
Generation of Bonding Diagrams for manufacturing assembly
Database Management of IC assembly Bill of Materials (BOM)
Collaboration with multiple Business Units
Management of CPTD specification
Participate in other activities/tasks as assigned by CPTD
Qualification
Required
Experience AutoCAD/Solid Works skill set (creation 3D models and 2D technical drawings)
Experience Auto LISP program
Database management
Custom program coding (LISP programs and Visual Basic)
Knowledgeable on Geometric tolerancing
Experience MS Office skills (specially on MS Access)
Knowledgeable in Cadence/ANSYS Software is a plus
5-7 years experience in Semiconductor industry
Preferred
Associate's degree preferred
Benefits
Health benefits that begin day one
Retirement savings plans
Industry leading ESPP program with a 2 year look back feature
Company
Microchip Technology Inc.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions.
H1B Sponsorship
Microchip Technology Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (170)
2024 (113)
2023 (116)
2022 (119)
2021 (94)
2020 (100)
Funding
Current Stage
Public CompanyTotal Funding
$3.22BKey Investors
Opportunity Now ColoradoSevenBridge Financial GroupSequoia Capital
2026-02-10Post Ipo Debt· $800M
2025-03-21Post Ipo Equity· $1.32B
2024-05-29Post Ipo Debt· $1.1B
Recent News
2026-02-07
2026-02-06
Company data provided by crunchbase