Texas Instruments · 12 hours ago
Field Applications Engineering Intern (Dallas, TX)
Texas Instruments is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips. They are seeking a Field Applications Engineer Intern to establish technical expertise and assist in providing system-level solutions for customers.
SemiconductorElectronicsComputerDSP
Responsibilities
Using various sales tools and relationships with design engineering to identify all potential projects
Providing customers with proactive proposals for complete, system-level solutions that maximize TI content
Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition
Qualification
Required
Pursuing a Bachelors degree in Electrical Engineering, Electronics Technology, Electrical Engineering Technology, Electrical and Computer Engineering or related field
Cumulative 3.0/4.0 GPA or higher
Basic understanding of schematics, layouts and digital components
Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)
Preferred
Experience with lab equipment such as oscilloscopes, along with soldering and debugging skills
Programming skills in C/C++ (LabView recommended)
Demonstrated strong analytical and problem solving skills
Excellent communication and presentation skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Ability to build lasting, influential relationships, both inside and outside the organization
Ability to work effectively in a fast-paced and ever-changing environment
Ability to take initiative and drive for results
Ability to influence decisions through a sense of urgency and competitive drive
Benefits
Competitive pay and benefits
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Recent News
Dallas Morning News
2026-02-13
2026-02-12
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