GlobalFoundries · 1 month ago
3D Advanced Heterogeneous Integration Development Intern (Summer 2026)
GlobalFoundries is a leading full-service semiconductor foundry providing design, development, and fabrication services. They are seeking an engineering intern to contribute to 3D Advanced Heterogeneous Integration Development, focusing on hybrid bonding and process development.
ElectronicsManufacturingSemiconductor
Responsibilities
Performing DOEs utilizing internal semiconductor tooling and at external partners
Analyzing engineering data from experiments and optimizations
Modeling of processes
Assisting engineers in daily integration/process development tasks
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Qualification
Required
Education – At least a sophomore at time of application and actively pursuing a Bachelors or Masters in Engineering or related field through an accredited degree program during the internship
Must have at least an overall 3.0 GPA and be in good academic standing
Language Fluency - English (Written & Verbal)
Travel - Up to 10%
Ability to work at least 40 hours per week during the internship
Preferred
Education – Pursuing a PhD in Engineering or related field through an accredited degree program during the internship
Prior related internship or co-op experience
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc
Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity
Strong written and verbal communication skills
Strong planning & organizational skills
Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus
6-month co-op position preferred for this role
Company
GlobalFoundries
GlobalFoundries is a full-service semiconductor foundry that manufactures integrated circuits in high volume.
H1B Sponsorship
GlobalFoundries has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
85%
Represents job field similar to this job
Engineering and Development
Management and Executive
Accounting and Finance
Sales
Product Management
Customer Service and Support
Marketing
Human Resources
Trends of Total Sponsorships
*2026 (18)
2025 (112)
2024 (76)
2023 (65)
2022 (100)
2021 (87)
2020 (187)
Funding
Current Stage
Public CompanyTotal Funding
$5.24BKey Investors
European CommissionU.S. Department of CommerceU.S. Department of Defense
2026-03-11Post Ipo Secondary· $840M
2025-12-11Grant· $581.23M
2024-11-20Grant· $1.5B
Recent News
2026-05-08
Company data provided by crunchbase