Broadcom · 4 days ago
COPD (Customer Owned Physical Design) Engineer
Maximize your interview chances
MobileSemiconductor
H1B Sponsor Likely
Insider Connection @Broadcom
Get 3x more responses when you reach out via email instead of LinkedIn.
Responsibilities
Manage external customer ASIC programs from inception to finish, including RFQs, legal, technology and IP collaterals, design, test, packaging, fabrication, bring-up and production.
Be a primary point of interface between the customer and Broadcom internal engineering teams and build a strong collaborative relationship with all stakeholders.
Advise customers on best practices in EDA, flows and design methodologies, and by organizing Q&A sessions with Broadcom technology experts.
See ahead, plan ahead, work ahead. Proactively assess potential risks to the design quality, project schedule, then work with cross-functional teams to prepare and execute risk mitigation actions.
Diligently organize, prioritize and manage multiple tasks.
Execute physical design flows to check that incoming customer tape-in netlists meet Broadcom’s stringent tape-out quality standards.
Motivate and drive yourself to stay abreast of developments in Broadcom IPs, technology and end user applications.
Participate in discussions about your chips with marketing, sales, legal and regulatory compliance teams.
Being a consummate team player, lend your technical expertise to internal engineering teams for critical projects.
Qualification
Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.
Required
Multiple tape-outs in advanced technology nodes (16 FinFet and lower)
Analyze PPA tradeoffs involved amongst various library components, and architectures.
Knowledgeable in low power design and power management.
Hands-on experience in physical design and STA
Well verse in EDA tools for physical design verification and sign-off.
Knowledge of ASIC design flow including physical design, logic simulation, test, and packaging.
Programming in TCL, shell and scripting languages
BS in Electrical Engineering and 12+ years related experience or MS in Electrical Engineering and 10+ years related experience.
Preferred
Exposure to SERDES communications protocols.
Logic design, chip architecture, microarchitecture, Verilog RTL coding
Front-end logic design verification, DRC, logic synthesis
Knowledge of DFT methods including scan, boundary scan, memory BIST and test and repair.
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Paid Family Leave and other leaves of absence.
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2023 (63)
2022 (113)
2021 (112)
2020 (79)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Recent News
The Motley Fool
2024-12-23
The Motley Fool
2024-12-23
TradingView
2024-12-23
Company data provided by crunchbase