Blu Omega · 8 hours ago

Lead Process Integration Engineer

United States

Full-time

Remote

Senior Level, Lead/Staff

$175K/yr - $215K/yr

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Sarah Stewart

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Responsibilities

Provide technical input for the facilities planning, including use cases, tools required, facility requirements, etc.

Provide updates to CHIPS NAPMP leadership and staff on technical progress, risks, and opportunities related to the NAPPF, to speed up the stand-up of the facility, maximize programmatic outcomes, and reduce costs. This task will include, but is not limited to, interacting with external facility design engineers, NAPMP and NSTC teammates, and others within the DOC.

Coordinate with infrastructure working groups and other CHIPS technical programs. Identify the right tools or equipment needed to support the manufacturing processes and ensuring the alignment with the facility's requirements. Provide planning, design, and decision-making stages before the tools are purchased or implemented by evaluating options, setting specifications, and ensuring tools meet the desired outcomes.

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Semiconductor packagingAdvanced packaging processesFront-end semiconductor fabricationTool selectionProcess engineeringSemiconductor Test experienceFactory operationsFacility managementSemiconductor Equipment EngineeringContracted operator management

Required

Hands-on experience in semiconductor packaging, encompassing manufacturing, operations, and process engineering within a commercial or R&D environment.

Expertise in advanced packaging or front-end semiconductor fabrication processes.

Experience making strategic decisions and early stage engineering input for upstream tool selection and specification development.

Technical input for the facilities planning, including use cases, tools required, facility requirements, etc.

Updates to CHIPS NAPMP leadership and staff on technical progress, risks, and opportunities related to the NAPPF.

Coordination with infrastructure working groups and other CHIPS technical programs.

Identification of the right tools or equipment needed to support the manufacturing processes and ensuring alignment with the facility's requirements.

Planning, design, and decision-making stages before the tools are purchased or implemented by evaluating options, setting specifications, and ensuring tools meet the desired outcomes.

Experience in semiconductor packaging integration and development.

Advanced packaging and assembly process flows and manufacturing tool expertise.

Semiconductor Test experience.

Semiconductor or Packaging factory/fab operations.

Experience in managing a facility with an Operator.