Be an early applicantLess than 25 applicants
Booz Allen Hamilton · 2 days ago
Microelectronics Packaging SME
Washington, DC
Full-time
Onsite
Director
$76K/yr - $172K/yr
15+ years exp
Wonder how qualified you are to the job?
Maximize your interview chancesConsultingCyber Security
Insider Connection @Booz Allen Hamilton
Responsibilities
Leverage technical leadership to support defense clients in advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration.
Identify and assess the performance of packaging providers and technologies against defense needs and requirements.
Define strategies and technology assessment methods to enable shared understanding of defense packaging objectives, testing and evaluation of those technologies, and develop roadmaps, business models, and technology models for improved access and collaboration in the future.
Qualification
Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.
Required
15+ years of experience with hands-on engineering, including microelectronics packaging technologies
5+ years of experience with the design and analyses of electronic packaging failure modes in temperature cycling, shock, and vibration test conditions
Experience packaging structural, thermal, materials, or modeling toolkits, including ABAQUS, COMSOL, SOLIDWORKS, material testing for mechanical characterization, reliability testing methods, or data analyses
Knowledge of new packaging architectures, including multi-chip, chip on-chip, chip on the wafer, and package architecture assembly and reliability challenges
Knowledge of the types of packaging used today and the gaps in today’s technologies and approaches, ongoing research in advanced packaging, what promising efforts are underway, and their respective goals and timelines
Knowledge of microelectronics packaging performance parameters
Ability to perform analytical calculations of packaging performance, provide accurate technical assessment of various approaches, and incorporate these into technology roadmaps to guide industry activities
Ability to understand defense needs in advanced microelectronics packaging, evaluate the performance of various technologies and vendors, and define a technology and business roadmap that defines the path forward to senior stakeholders
Bachelor's degree in Engineering or Materials Science
Benefits
Health, life, disability, financial, and retirement benefits
Paid leave
Professional development
Tuition assistance
Work-life programs
Dependent care
Recognition awards program
Company
Booz Allen Hamilton
Booz Allen Hamilton is a consulting firm that specializes in analytics, technology, and engineering.
10,001+ employees
H1B Sponsorship
Booz Allen Hamilton has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (14)
2022 (31)
2021 (29)
2020 (38)
Funding
Current Stage
Public CompanyTotal Funding
$2.38B2023-08-01Post Ipo Debt· $650M
2020-08-13Post Ipo Debt· $700M
2015-02-02Post Ipo Secondary· $340.32M
Leadership Team
Horacio Rozanski
President and Chief Executive Officer
Karen Dahut
Executive Vice President
Recent News
2024-05-26
The Motley Fool
2024-05-26
2024-05-13
Company data provided by crunchbase
