Physical Design Engineer @ Tessolve | Jobright.ai
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Physical Design Engineer jobs in Austin, TX
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Tessolve · 6 hours ago

Physical Design Engineer

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ManufacturingSemiconductor
Hiring Manager
Amrit Anshuman Swain
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Responsibilities

Experience: 10yrs+
Synopsys Fusion Compiler/ICC2 (Synthesis, DFT insertion, Place & Route, Chip Finishing, PT-SI STA, Timing Closure, PV (DRC/ERC/PERC/LVS)
Synopsys DC, DCG, DC TOPO
Synopsys Flow Development & SOC implementation methodologies that will be deployed and used by our Synopsys customer Physical Design Implementation team members
Familiar with Synopsys Lynx a plus
RTL Hand-over experience a plus for RTL to GDS
Experience with top-level floorplanning, bump-maps, RDL IO Pad/Ring creation/verification, power grid creation/verification, hierarchal floorplanning/partitioning
Solid experience with full SOC clocking methodologies (H-Tree, Structure Clocking, MS CTS for Top/Blocks with push/down & bottoms up approaches)
Highly proficient with SDC STA constraints development driving back-end tools for blocks and full-chip through timing closure & sign-off
Ability to define sign-off requirements/margins based on Foundry technology requirements a plus
DFT experience with compression, scan, TDF, and MEMBIST a plus
Synopsys Formality for formal verification (RTL to Gate, Gate-to-Gate) & Formality ECO flows
Familiar with UPF flows & methodologies for multi-voltage power domains with turn on/turn off using UPF
Synopsys ICV for PV (Physical Verification – DRC/ERC/LVS/PERC)
Ansys Redhawk SC (For IR analysis for static, dynamic, & EMIR)
Experience in PD implementation/design closure on complex IP Sub-Systems such as PCIe, USB, MIPI, DDR, & HBM a plus
Experience with GlobalFoundries, TSMC, & Samsung technology nodes are a plus
Consultants should have a solid track record on execution delivering to high-quality standards for delivering to high quality tape-out

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Synopsys Fusion CompilerICC2DFT insertionPlace & RouteTiming ClosureSynopsys DCSOC implementation methodologiesTop-level floorplanningFull SOC clocking methodologiesSDC STA constraints developmentSynopsys FormalitySynopsys ICVAnsys Redhawk SCPD implementation/design closureRTL Hand-overBump-mapsRDL IO Pad/Ring creationPower grid creationHierarchal floorplanningSign-off requirementsDFT experienceUPF flowsGlobalFoundries technology nodesTSMC technology nodesSamsung technology nodes

Required

Experience: 10yrs+
Synopsys Fusion Compiler/ICC2 (Synthesis, DFT insertion, Place & Route, Chip Finishing, PT-SI STA, Timing Closure, PV (DRC/ERC/PERC/LVS)
Synopsys DC, DCG, DC TOPO
Synopsys Flow Development & SOC implementation methodologies that will be deployed and used by our Synopsys customer Physical Design Implementation team members
Solid experience with full SOC clocking methodologies (H-Tree, Structure Clocking, MS CTS for Top/Blocks with push/down & bottoms up approaches)
Highly proficient with SDC STA constraints development driving back-end tools for blocks and full-chip through timing closure & sign-off
Ability to define sign-off requirements/margins based on Foundry technology requirements
Synopsys Formality for formal verification (RTL to Gate, Gate-to-Gate) & Formality ECO flows
Synopsys ICV for PV (Physical Verification – DRC/ERC/LVS/PERC)
Ansys Redhawk SC (For IR analysis for static, dynamic, & EMIR)
Consultants should have a solid track record on execution delivering to high-quality standards for delivering to high quality tape-out

Preferred

Familiar with Synopsys Lynx
RTL Hand-over experience a plus for RTL to GDS
Experience with top-level floorplanning, bump-maps, RDL IO Pad/Ring creation/verification, power grid creation/verification, hierarchal floorplanning/partitioning
DFT experience with compression, scan, TDF, and MEMBIST a plus
Familiar with UPF flows & methodologies for multi-voltage power domains with turn on/turn off using UPF
Experience in PD implementation/design closure on complex IP Sub-Systems such as PCIe, USB, MIPI, DDR, & HBM a plus
Experience with GlobalFoundries, TSMC, & Samsung technology nodes are a plus

Company

Tessolve

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Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product.

Funding

Current Stage
Late Stage
Total Funding
$40M
Key Investors
Novo Tellus Capital PartnersReliance Venture Asset Management
2021-04-22Private Equity· $40M
2016-04-28Acquired· by Hero Electronix
2010-04-07Series C· Undisclosed

Leadership Team

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P Raja Manickam
Founder & CEO
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Huzefa Cutlerywala
SVP of Sales and Marketing
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Company data provided by crunchbase
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