Rambus · 2 days ago
Principal Product Engineer
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H1B Sponsorship
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Responsibilities
Define Test coverage, Flow, Characterization and Qualification for New Product Introduction.
Project management with effective communications skills with internal cross functional teams, customers and suppliers.
Manage multiple New product introduction in parallel from through Project kickoff to Production.
Set up and maintain infrastructure for New product introduction including detailed schedule and resource allocation for new products.
Complete life cycle of products from design, prototypes, high volume manufacturing bring up and RMA/sustaining support.
Experience in Failure Analysis and RMA support.
Optimize yield, Cost, Cycle Time and Quality.
Data Analysis proficiency. Software: PDF, JMP, Silicon Dash etc
Qualification
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Required
B.S./M.S. in Electrical Engineering or equivalent experience.
Experience in New Product Introduction.
Experience Product life cycle and BOM.
Experience working with Wafer fab Foundry and Test & Assembly OSAT's.
Experience and knowledge of ATE. Advantest V93k experience preferred.
Experience on DDR and High-speed Digital products.
Ability to independently learn and problem solve.
Comfort with collaboration, open communication and reaching across functional borders.
Benefits
Base salary
Bonus
Equity
Matching 401(k)
Employee stock purchase plan
Comprehensive medical and dental benefits
Time-off program
Gym membership
Company
Rambus
Rambus designs, develops and licenses chip interface technologies and architectures that are used in digital electronics products.
H1B Sponsorship
Rambus has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (4)
2022 (9)
2021 (4)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
$288.57M2023-07-25Acquired· by Cadence Design Systems
2011-06-07Post Ipo Equity· $88.57M
2010-02-02Post Ipo Equity· $200M
Recent News
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