Veeco · 6 days ago
Process Development Engineer
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H1B Sponsorship
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Responsibilities
Lead process and application development using Veeco’s ion beam deposition and etch technologies
Manage the development of advanced thin film processes, design experiments, and analyze data
Develop and maintain best known methods for process control and continuous improvement
Engage with customers as a technical expert and help establish technical partnerships
Work with Sales and Marketing to define process specifications for Veeco tools
Develop new upgrades and hardware for Veeco’s unique deposition and etch technologies
Qualification
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Required
Master's degree and 3+ years of experience or a PhD in Physics, Materials Science or a related field is required.
Must have process development experience in and expertise with vacuum thin film technology.
Experience with thin film for metals is highly desired.
Expertise with thin film characterization techniques such as four-point probe, stress measurements, ellipsometry, absorption/transmission spectroscopy, XRD/XRR, depth profilers, etc. is required.
Preferred
Background in metal and semiconductor thin films technologies preferred.
Semiconductor device knowledge and module process, process integration experience in logic and/or memory fabrication.
Self-directed and possess excellent interpersonal/communication skills.
Collaborative attitude and comfortable with change and ambiguity.
Must be able to travel up to 30% both domestic and international.
Company
Veeco
Making a Material Difference is at the core of our DNA.
H1B Sponsorship
Veeco has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (11)
2022 (4)
2021 (10)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
$213.85MKey Investors
US Department of Energy
2023-05-16Post Ipo Debt· $205M
2017-01-11Post Ipo Debt· Undisclosed
2011-06-13Grant· $4M
Recent News
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2024-05-07
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