Tokyo Electron US · 2 days ago
Process Engineer II
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Responsibilities
Responsible for development and support of metal deposition processes for advanced 300 mm wafer fabrication.
Works closely with TEL factory and customer development teams to optimize process conditions to meet customer targets.
Designs/executes experiments and performs statistical data analysis to identify key process interactions and troubleshoot process issues.
Works closely with HW engineering and field service teams to help resolve equipment/process issues, by analyzing process data and writing process recipes to test/partition possible root causes of issues.
Provides regular, clear and concise technical updates and presentations to customer, factory and equipment engineering/management teams.
Qualification
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Required
Undergraduate degree required in related science/engineering field, preferably Chemical Engineering, Materials Science/Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, or Physics.
Prefer Bachelor's Degree with at least 4 years of related experience; or Master's Degree with at least 2 years of related experience; or Ph.D. degree considered without additional experience depending on research background.
High school diploma or equivalent required.
Candidates must be able to work in a clean room environment, which includes wearing specialized clean room attire (such as gowns, gloves, masks, and hairnets) for extended periods.
Candidates should be comfortable working in a highly regulated, meticulous setting where adherence to strict cleanliness and safety protocols is essential.
Company
Tokyo Electron US
Since its founding in 1963, TEL has grown to encompass many offices around the world that engineer, manufacture, sell, and service wafer-processing or semiconductor production equipment (SPE), as well as flat panel display (FPD) and thin-film silicon photovoltaic equipment (PVE).
H1B Sponsorship
Tokyo Electron US has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (9)
2022 (9)
2021 (4)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
unknown1980-06-02IPO· tyo:8035
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