NVIDIA · 5 days ago
Senior Package Design Engineer
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Responsibilities
Define the chip pad ring, substrate interconnect scheme, and lead the package layout design process for package test vehicles
Focus primarily on flip chip and 2.5D interposer based packages
Implement electrical/mechanical/thermal structures in test vehicles for effective package technology evaluations
Develop design flow for new package technologies
Collaborate with cross functional teams to incorporate various requirements in package designs
Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules
Qualification
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Required
BS in EE or ME (or equivalent experience)
6+ years package design experience
Strong programming skills (Perl, Python, Tcl desired)
Working knowledge of Cadence Allegro Packaging Design (APD)
Experience in 2.5D packages
Strong problem solving skills
Benefits
Equity
Company
NVIDIA
NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.
H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (735)
2022 (892)
2021 (696)
2020 (534)
Funding
Current Stage
Public CompanyTotal Funding
$4.09BKey Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2017-05-24Post Ipo Equity· $4B
Recent News
2024-06-06
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