NVIDIA · 2 days ago
Senior Package Layout Engineer
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Artificial Intelligence (AI)GPU
Insider Connection @NVIDIA
Responsibilities
Collaborate with Technical Package Lead and design teams in the layout of IC substrates for NVIDIA products.
Plan schedules, resolve costs, manufacturing, and electrical design issues.
Implement high speed/density ASIC packages and perform substrate breakout patterns.
Optimize package pinout and assist in package routing, placement, stack-up, reference plane, and power distribution.
Propose layout design trade-offs, conduct feasibility studies, and develop symbols and CAD library databases.
Develop methodologies to enhance layout productivity.
Qualification
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Required
Hold a B.S. Electrical Engineering or equivalent experience
8+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Your validated working knowledge of high-speed design signal integrity practices
Preferred
Experience using Valor is helpful
Benefits
Equity
Company
NVIDIA
NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.
H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (735)
2022 (892)
2021 (696)
2020 (534)
Funding
Current Stage
Public CompanyTotal Funding
$4.09BKey Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2017-05-24Post Ipo Equity· $4B
Recent News
2024-06-06
2024-06-06
2024-06-06
Company data provided by crunchbase