Qorvo, Inc. · 6 days ago
Senior Product Package Engineer
Wonder how qualified you are to the job?
Maximize your interview chances
Network HardwareSemiconductor
H1B Sponsorship
Insider Connection @Qorvo, Inc.
Responsibilities
Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem-solving.
Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.
Develop and deploy advanced design rules into next-generation products.
Work in collaboration with technology and business units to deploy next-generation packaging solutions incorporating GaN, Si, and GaAs semiconductor devices into products.
Qualification
Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.
Required
7-10 years’ direct experience in semiconductor packaging.
BS, or higher in Engineering or Material science.
Preferred
Thorough industry knowledge and experience of packaging technologies.
Strong background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages.
Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.
Strong understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment
Proven track record of supporting New Product and/or Technology through innovative packaging solutions.
Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
Experience with Program Management Methodology
Company
Qorvo, Inc.
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.
H1B Sponsorship
Qorvo, Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (39)
2022 (78)
2021 (98)
2020 (67)
Funding
Current Stage
Public CompanyTotal Funding
$350M2019-09-30Post Ipo Debt· $350M
2015-01-09IPO· nasdaq:QRVO
Recent News
2024-06-04
2024-05-23
Company data provided by crunchbase