Chairman and CEO

SVP & CTO, Optical Engineering

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0.375 Advanced Package Technology Principal Engineer

Marvell Technology is a leading provider of semiconductor solutions that form the backbone of data infrastructure. The Advanced Package Technology Principal Engineer will own the packaging technology roadmap for AI XPU, lead co-design efforts, and explore innovative technologies to maximize performance while collaborating with cross-functional teams.

CFO and Treasurer

Chief Strategy Officer & President Materials Segment

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Principal Silicon Photonics Packaging Engineer

Coherent Corp. is a global leader in lasers, engineered materials, and networking components, seeking a Principal Silicon Photonics Packaging Engineer. The role involves driving product packaging activities from concept to production, developing co-design processes, and collaborating with cross-functional teams to ensure manufacturability and reliability of optical packages.

Communications Manager, CEO

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Principal Engineer - Silicon Packaging Architect

Intel Corporation is seeking a Silicon Packaging Architect within its Central Engineering Group, responsible for bridging silicon design and advanced packaging. The role focuses on delivering high-performance, cost-effective solutions for next-generation SOCs and DDR PHY interfaces, involving collaboration with technical experts and hands-on simulations.

President and Chief Executive Officer

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Principal IC Packaging Engineer

Qualcomm Technologies, Inc. is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit packaging technologies. This role focuses on spearheading new product introductions for cutting-edge package technologies, particularly targeting Data Center AI, Power Management, and emerging markets.

VP Materials Engineering

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IC Packaging Automation Engineer, Electrical

SpaceX is actively developing technologies to enable human life on Mars and is looking for an IC Packaging Automation Engineer for its Starlink project. The role involves designing and managing automation projects for semiconductor packaging, ensuring compliance with safety regulations, and collaborating with various teams to enhance production efficiency.

IC Packaging Automation Engineer, Electrical (Starlink)

0.4444444477558136

ICE (In-Circuit Emulation) Technology and Model Development Principal Engineer

Intel Corporation is a leading technology company specializing in advanced semiconductor solutions. The role involves leading the design and implementation of emulation technologies for next-generation SoCs, focusing on functional validation and system integration.

Chairman, President & CEO

Senior Vice President BE Operations

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Global Quality IC Package Design/Development Quality Assurance Principal Engineer

Micron Technology is a world leader in innovating memory and storage solutions. As a GQ Package Design/Development Quality Assurance Principal Engineer, you will be responsible for ensuring the quality and reliability of new IC package technology introductions and act as a subject matter expert in mitigating risks associated with Chip-Package Interaction.

0.25 IC Package Engineer

SpaceX is actively developing technologies to enable human life on Mars. They are seeking a highly skilled IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit packaging solutions, working cross-functionally to deliver optimized semiconductor packaging.

IC Package Engineer (Starlink/Akoustis)

0.75 IC Packaging Test Engineer, Silicon Technology

SpaceX is actively developing technologies to enable human life on Mars. The IC Packaging Test Engineer will work on semiconductor packaging and wafer testing, developing production test solutions and ensuring product conformance.

IC Packaging Test Engineer, Silicon Technology (Starlink)

IC Packaging Automation Engineer, Software (Starlink)

SpaceX is a company focused on enabling human life on Mars through advanced technology. They are seeking an IC Packaging Automation Engineer to develop and commission production packaging automation solutions for their Starlink project, which aims to provide fast internet globally.

0.875 Principal IC Packaging Test Engineer, Silicon Technology

SpaceX is a pioneering aerospace manufacturer and space transport services company focused on enabling human life on Mars. They are seeking a Principal IC Packaging Test Engineer to lead the development and manufacturing of integrated circuit packaging and assembly for the Starlink broadband internet system, ensuring product conformance through comprehensive testing solutions.