Research Engineer Ii Semiconductor Fabrication And Advanced Packaging in united states (1000+)
1 day agoBe an early applicant
Research Engineer II- Semiconductor Fabrication and Advanced Packaging
Georgia Institute of Technology
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Education · Higher Education · Late Stage
Less than 25 applicants
2 days ago
Principal Application Engineer - Semiconductor Advanced Package
Henkel
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Beauty · Home Services · Public
123 applicants
1 month ago
Advanced Semiconductor Packaging Engineer
The Aerospace Corporation
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National Defense · Aerospace · Late Stage
Less than 25 applicants
No H1B
4 months ago
Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration
ALTEN
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Information Technology · Public
Less than 25 applicants
2 weeks ago
Sr. Advanced Semiconductor Packaging Engineer - 653
Quantinuum
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Quantum Computing · Cyber Security · Growth Stage
Less than 25 applicants
No H1B
4 months ago
Principal Application Engineer – Semiconductor Advanced Package
Veracity Software Inc
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SaaS · Software · Growth Stage
Less than 25 applicants
4 months ago
Principal Application Engineer – Semiconductor Advanced Package
Veracity Software Pvt. Ltd.
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Information Technology & Services · Growth Stage
51 applicants
1 month ago
Advanced Semiconductor Packaging Engineer
The Aerospace Corporation
/
National Defense · Aerospace · Late Stage
66 applicants
No H1B
10 hours agoBe an early applicant
Postdoctoral researcher—Thin film photoabsorber development
National Laboratory of the Rockies
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Energy · Renewable Energy · Late Stage
Less than 25 applicants
9 hours agoBe an early applicant
Optical Manufacturing Engineer
Belcan
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Enterprise Software · Industrial · Late Stage
Less than 25 applicants
No H1B
9 hours agoBe an early applicant
Packaging Module Process Development Engineer
Intel Corporation
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Semiconductors · Late Stage
Less than 25 applicants
7 hours agoBe an early applicant
Staff Manufacturing Engineer - Battery
Rivian
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Electric Vehicle · Transportation · Public
Less than 25 applicants
13 hours agoBe an early applicant
Sr. Principal Engineer, Process System Owner – Device Assembly and Packaging (DAP)
Johnson & Johnson Innovative Medicine
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Pharmaceuticals · Late Stage
Less than 25 applicants
16 hours ago
Sr Manager, Semiconductor Product Engineering
Micron Technology
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Semiconductor · Electronics · Public
48 applicants
18 hours ago
Optical Assembly Process Engineer
Excelitas Technologies Corp.
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Enterprise Software · Electronics · Late Stage
119 applicants
16 hours agoBe an early applicant
Wafer fab Technician
Coherent Corp.
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Semiconductors · Late Stage
Less than 25 applicants
13 hours agoBe an early applicant
KUMDC5736294-- Packaging Engineer
Compunnel Inc.
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Information Technology & Services · Late Stage
Less than 25 applicants
15 hours agoBe an early applicant
Senior/Staff Packaging Development Engineer
Monolithic Power Systems, Inc.
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Semiconductor · Energy · Public
Less than 25 applicants
19 hours ago
Sr. Principal Engineer, Process System Owner – Device Assembly and Packaging (DAP)
Johnson & Johnson
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Hospital & Health Care · Late Stage
38 applicants
1 day agoBe an early applicant
Semiconductor Lithography Process Engineering Manager
Keysight Technologies
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Telecom & Communications · Cloud Computing · Public
Less than 25 applicants
No H1B