Microchip Technology Inc. · 4 months ago
Principal Engineer - Packaging
CA - San Jose - 3850 N. First St
Full-time
Onsite
Senior Level, Lead/Staff
$70K/yr - $163K/yr
10+ years expMicrochip Technology Inc. is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. They are seeking a highly motivated and experienced Principal Packaging Engineer to join their NPI Packaging team, responsible for advanced semiconductor package development and collaboration across engineering teams.
AutomotiveManufacturingSemiconductorWireless
Responsibilities
Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages
Work with business unit’s IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit’s roadmap for new products
Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology
Create package design documentation and assembly instructions
Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology/structure development etc.)
Manage package qualification for commercial and automotive applications
Coordinate with assembly vendors on new packages from development to high volume production
Qualification
Required
Bachelor's or Master's Degree in Electrical or Mechanical Engineering
Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging
Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA, WLCSP, wire bond BGA, and CSP
Strong understanding of materials as related to chip packaging interaction
Familiar with wafer BEOL (top metal, passivation, UBM, bumping etc.)
Strong knowledge of advanced substrate manufacturing/process
Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification
Proven project management, communication, and leadership skills
Willingness and ability to grow expertise in multiple disciplines, including manufacturing/quality, materials, electrical, thermal, and mechanical engineering
Strong technical skills in resolving customer issues related to IC package quality and reliability
Travel up to 10% is expected
Preferred
Experience with Ansys Electronic Desktop
Knowledgeable with failure analysis techniques on package technologies
Experience with Cadence APD and AutoCad for custom substrate design
Benefits
Health benefits that begin day one
Retirement savings plans
Industry leading ESPP program with a 2 year look back feature
Company
Microchip Technology Inc.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions.
10001+ employees
H1B Sponsorship
Microchip Technology Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (170)
2024 (113)
2023 (116)
2022 (119)
2021 (94)
2020 (100)
Funding
Current Stage
Public CompanyTotal Funding
$2.42BKey Investors
Opportunity Now ColoradoSevenBridge Financial GroupSequoia Capital
2025-03-21Post Ipo Equity· $1.32B
2024-05-29Post Ipo Debt· $1.1B
2024-03-19Grant· $1.06M
Leadership Team
Steve Sanghi
CEO and President
Rich Simoncic
Chief Operating Officer
Recent News
Tech in Asia
2026-01-09
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2026-01-09
Morningstar.com
2026-01-09
Company data provided by crunchbase