Qualcomm · 1 month ago
Principal IC Packaging Engineer
San Diego, California, United States of America
Full-time
Onsite
Senior Level, Lead/Staff
$202K/yr - $302K/yr
6+ years expQualcomm Technologies, Inc. is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit packaging technologies. The role focuses on spearheading new product introductions for cutting-edge package technologies, particularly targeting Data Center AI and Power Management, while driving innovation from concept to high-volume manufacturing.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Provide leadership and take responsibility for the development of advanced packaging technologies, including wafer bonding, RDL, 3D, wafer dicing, and 2.5D packaging
Oversee new product introductions and ensure smooth transition to high-volume manufacturing
Leverage subject matter expertise in package architecture, high-density interconnect package design, as well as performance, reliability, and cost constraints
Apply hands-on experience in packaging assembly processes, materials, equipment, and adherence to design rules
Collaborate with and manage multiple foundries and OSATs to advance packaging solutions from concept to full-scale production
Lead cross-functional teams and manage multiple concurrent programs
Resolve complex technical issues encountered throughout the development and manufacturing process
Qualification
Required
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience
Preferred
M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering, or equivalent experience
Seventeen or more years of hands-on experience in packaging technology development, specifically in 2.5D/3D for high-density die-to-die (D2D) interconnects, RDL, fan-out bridges, FCBGA, MCM, and related disciplines
Comprehensive understanding of semiconductor industry packaging trends, end-user packaging requirements, and prior experience with high-performance computing products
Familiarity with reliability standards, test methods, qualification procedures, and failure analysis techniques
Knowledge of substrate manufacturing processes and design rules
Excellent verbal and written communication skills
Demonstrated ability in organized technical project management
Ability to work independently and lead multiple programs simultaneously
Proven capability to lead multi-functional teams and resolve complex technical problems
Familiarity with working alongside contract manufacturers (CM) on data center and rack design is considered an advantage
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package designed to support your success at work, at home, and at play
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
Recent News
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