Lockheed Martin · 11 hours ago
Lead RFIC Advanced Packaging Engineer
Moorestown, NJ
Part-time
Hybrid
Lead/StaffLockheed Martin is a leader in innovation and integrity, seeking an experienced RF Integrated Circuits (IC) Advanced Packaging Design Engineer to join their IC Design team in Moorestown NJ. The role involves architecting concepts, designing, testing, and releasing advanced packaging solutions for defense applications, while also leading projects and collaborating with various engineering disciplines.
AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
Responsibilities
Architect RF/Analog System In Package (SIP) and or 3D Heterogeneously Integrated (3DHI) Multi-IC sub-system designs
Develop packaging floor planning, and detailed routing of packaged systems in step with advanced packaging mechanical engineers
Work on and collaborate with cross functional teams with other engineering disciplines
Use state of the art EDA tools including Keysight ADS, Ansys HFSS, Cadence Virtuoso Studio, AWR and Allegro X Advanced Packaging Designer
Participate in the design of RF/Analog Mixed Signal/MMICs in state of the art Bi-CMOS, SiGe-CMOS, GaAs, GaN, InP technology nodes
Mentor less experienced engineers
Attend industry conferences and to keep up-to-date on related industry best practices and technological advancements
Qualification
Required
Desire to learn new skills and technologies
The ability to collaborate effectively
Documentation of requirements, simulation, and verification in support of design assurance and reuse
Development of verification plans for next higher assembly integration
Strong RF Simulation skills using Keysight ADS and or AWR simulation platforms
Strong Hspice analog circuit analysis skills inclusive of statistical design variations
Use of standard lab equipment, i.e. oscilloscopes, signal generators, spectrum analyzers, and etc
Preferred
Experience in IC design packaging, SIP, 2.5/3DHI systems or working knowledge
IC design experience or working knowledge of RF/Analog Mixed Signal/MMICs in state of the art Bi-CMOS, SiGe-CMOS, GaAs, GaN, InP technology nodes
Benefits
Flexible schedules
Competitive pay
Comprehensive benefits
Company
Lockheed Martin
Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.
Founded in 1912
10001+ employees
H1B Sponsorship
Lockheed Martin has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2023 (1)
2022 (1)
2021 (2)
Funding
Current Stage
Public CompanyTotal Funding
$6.06BKey Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M
Leadership Team
Jim Taiclet
Chairman, President & CEO
Craig Martell
Chief Technology Officer
Recent News
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2026-01-11
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