II-VI Aerospace & Defense · 2 months ago
Principal Silicon Photonics Packaging Engineer
48800 Milmont Drive, Fremont, CA, 94538, US
Full-time
Onsite
Senior Level, Lead/Staff
$114K/yr - $223K/yr
7+ years expII-VI Aerospace & Defense is a global leader in lasers, engineered materials and networking components. They are seeking a Principal Silicon Photonics Packaging Engineer to drive product packaging activities from initial concept to production, collaborate with cross-functional teams, and lead optical package development to ensure manufacturability and reliability.
AerospaceAppsManufacturingSpace Travel
Responsibilities
Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production
Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan
Lead PIC and EIC interconnect schematic and monitor layout design process
Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets
Lead optical package development to establish package manufacturability and reliability
Collaborate with cross-functional teams consisting of Silicon Photonics, IC design, substrate layout, and module design teams
Qualification
Required
Bachelor's degree with 9 years of related experience in optical and IC packaging
Or Master's degree with 7 years; or a PhD with 4 years experience
Expertise in advanced IC packaging design, FOWLP, RDL, bumping, flip-chip
Experience with high-speed differential and single ended impedance-controlled signal routing
Experience with Silicon Photonics IC packaging
Experience with organic substrate design and packaging
Company
II-VI Aerospace & Defense
II-VI Aerospace & Defense provides optical assemblies.
201-500 employees
Funding
Current Stage
Growth StageLeadership Team
Sheila Campbell
Sr. Human Resources Business Partner
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